72dpi_a_saba-505.jpg
72dpi_a_saba-505.jpg
Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
Photo: Antonio Saba. Photographer. www.antoniosaba.com
Wire bonding work at CERN.
72dpi_a_saba-505.jpg
72dpi_a_saba-505.jpg
Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
Photo: Antonio Saba. Photographer. www.antoniosaba.com
Wire bonding work at CERN.