72dpi_a_saba-501.jpg
72dpi_a_saba-501.jpg
2 ladders are connected via a multi layer aluminium polyimide flexible cable with a multi chip module
containing several custom designed ASICs.
The production of the flexible cable was developed and carrier out at CERN. It provides signal and
data lines as well as power to the individual readout chipswith a total thickness of only 220 microns.
In the photograph, one can see the interconnection from one readout chip to the flexible cable
realized with ultrasonic wire bonds (25 microns).
Photo: Antonio Saba. Photographer. www.antoniosaba.com